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product structure: semiconductor ic this product is not designed for protection against radioactive rays . 1/ 20 tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 tsz22111 ? 14 ? 001 www.rohm.com inverter for motor control 600v igbt intelligent power module (ipm) for low speed switching drive bm63 363 s- va bm63363s- vc general description bm63363s- va /- vc is an intelligent power module composed of gate drivers , bootstrap diodes , igbts, fly wheel di ode s. low saturation voltage igbts optimized for low speed switching drive (to 6khz) such as a compressor is adopted. please examine high speed switching series for high speed switching drive. features ? 3phase dc/ac inverter ? 600v/10a ? low side igbt open emitter ? built -in bootstrap diode ? high side igbt gate driver(hvic): soi (silicon on insulator) process, drive circuit, high voltage level shifting, current limit for bootstrap diode, control supply u nder -voltage locked out (uvlo) ? low side igbt gate driver(lvic): drive circuit, short circuit current protection (scp), control supply under voltage locked out (uvlo), thermal shutdown (tsd) ? fault signal(lvic) corresponding to scp (low side igbt), tsd, uvlo f ault ? input interface 3.3v, 5v line application ? low speed switching drive of ac100 to 240vrms(dc voltage: less than 400v) class motor ? low speed switching drive of compressor motor for air conditioner, washing machine, refrigerator key specifications ? igbt collector-emitter voltage v ce sat : 1.5v(typ) ? fwd forward voltage v f : 1.5v(typ) ? fwd reverse recovery time t rr : 100ns(typ) ? module case temperature t c : - 25 to +100c ? junction temperature t jmax : 150 c package w(typ) x d(typ) x h(typ) hsdip 25 38.0mm x 24.0mm x 3.5 mm hsdip25vc 38.0mm x 24.0mm x 3.5mm typical application circ uit figure 1. example of application circuit hinu hinv hinw hvcc gnd linu linv linw lvcc fo cin gnd p u v w nu nv nw m 24 23 22 21 20 19 18 mcu + 8 9 15 16 15v 14 10 11 12 13 5 6 7 5v + 2 3 4 + vbw vbv vbu + + hsdip25 datashee t downloaded from: http:///
2/ 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 pin configuration pin description pin no. pin name function pin no. pin name function 1 nc no connection(gnd potential) 14 fo alarm output 2 vbu u phase floating control supply 15 cin detecting of short circuit current trip voltage 3 vbv v phase floating control supply 16 gnd ground (note 1) 4 vbw w phase floating control supply 17 nc no connection (note 2) 5 hinu u phase high side igbt control 18 nw w phase low side igbt emitter 6 hinv v phase high side igbt control 19 nv v phase low side igbt emitter 7 hinw w phase high side igbt control 20 nu u phase low side igbt emitter 8 hvcc control supply for hvic 21 w w phase output 9 gnd ground (note 1) 22 v v phase output 10 linu u phase low side igbt control 23 u u phase output 11 linv v phase low side igbt control 24 p inverter supply 12 linw w phase low side igbt control 25 nc no connection (note 2) 13 lvcc control supply for lvic (note 1) two gnd pins (9 & 16pin) are connected inside ipm, please connect one pin ( 16pin is recommended) to the 15v power supply gnd outside and leave the other open. (note 2) nc pins (17 & 25pin) are not electrically connected to any other potential inside. figure 2. pin configuration and tc detecting point 18 25 19 20 21 22 23 24 nw nv nu w v u p nc nc vbu vbv vbw hinu hinv hinw hvcc gnd linu linv linw lvcc fo cin gnd nc top view tc detecting point 17 25 18 1 12.6mm 9.2mm downloaded from: http:///
3/ 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 block diagram description of block 1) high side igbt drive (hvic, bootstrap d iode) high voltage level shifting circuit drives high side igbt. built-in bootstrap diode and current limit function for bootstrap diode enable hvic to drive high side igbt without external component (bootstrap diode, resistor). there is under-voltage-locked-out (uvlo) function for floating control power supply. 2 ) low side igbt drive (lvic) there is short circuit current protection (scp), under -voltage locked out (uvlo) for control power supply lvcc, thermal shutdown (tsd) function. alarm signal (fo) will output when these protection circuits work. vbu vbv vbw hinu hinv hinw hvcc gnd linu linv linw lvcc fo cin gnd p u v w nu nv nw low side gate driver (lvic) high side gate driver (hvic) 24 23 22 21 20 19 18 2 3 4 8 9 15 16 14 10 11 12 13 5 6 7 figure 3. block diagram downloaded from: http:///
4/ 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (unless otherwise specified, tj=25 c) inverter part item symbol ratings unit co nditions supply voltage v p 450 v applied between p-nu,nv,nw supply voltage(surge) v p(surge) 500 v applied between p-nu,nv,nw collector-emitter voltage v ces 600 v collector current dc i c 10 (note 1) a t c =25c peak i cp 30 (note 1) a t c =25c , less than 1ms collector power dissipation p c 33 w t c =25c , per 1 chip junction temperature t jmax 150 c (note 1) do not, however exceed p c , as o. control part item symbol ratings unit conditions control power supply v cc 20 v applied between hvcc-gnd, lvcc- gn d floating control power supply v bs 20 v applied between vbu -u, vbv-v, vbw-w control input voltage v in -0.5 to v cc +0.5 v applied between hinx, linx-gnd (x=u,v, w) fault output supply voltage v fo -0.5 to v cc +0.5 v applied between fo -gnd fault output current i fo 1 ma sink current at f o pin current sensing input voltage v cin -0.5 to +7.0 v applied between cin- gn d bootstrap diode p art item symbol ratings unit conditions reverse voltage v rb 600 v junction temperature t jmaxd 150 c total system item symbol ratings unit conditions self protection supply voltage (scp capability) v p(prot) 400 v v cc =13.5 to 16.5v, inverter part t j =125c, non-repetitive, less than 2s module case temperature t c - 25 to +100 c measurement point of t c is provided in figur e 2 storage temperature t stg - 40 to +125 c isolation voltage v iso 1500 v rms sinusoidal , 60hz, ac 1minute, between connected all pins and hea t sink plate thermal resistance item symbol limit unit conditions min typ max junction to case thermal resistance (note 2) r th(j-c)_igbt - - 3. 7 c /w inverter igbt(1/6 module) r th(j-c)_fwd - - 4.5 c /w inverter fwd(1/6 module) (note 2) grease with good conductivity and high reliability should be applied evenly with +100 to +200m on the contacting surface of ipm and heat sink. use a torque wrench to fasten up to the specified torque rating. the contacting thermal resistanc e between ipm case and heat sink is determined by the thickness and the thermal conductivity of the applied grease. caution: operating the ipm over the absolute maximum ratings may damage the i pm . the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as ad ding a fuse, in case the i pm is operated over the absolute maximum ratings. downloaded from: http:///
5/ 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 recommended operating conditions item symbol limit unit conditions min typ max supply voltage v p 0 300 400 v applied between p-nu,nv,nw control power supply v cc 13.5 15.0 16.5 v applied between hvcc-gnd, lvcc-gnd floating control power supply v bs 13.0 15.0 18.5 v applied between vbu -u, vbv-v, vbw-w control power supply variation S v cc S v bs -1 - +1 v/ s control input voltage v in 0 - 5.5 v current sensing input voltage v cin 0 - 5.5 v blanking time for preventing arm -short t dead 1.5 - - s for each input signal pwm input frequency f pwm - - 6 khz t c 100 c , t j 125 c high side igbt minimum input pulse width (note1) pw on h 0.8 - - s pw offh 0.8 - - s low side igbt minimum input pulse width (note1) pw on l 2.5 - - s pw offl 0.8 - - s voltage variation between gnd- nu, nv, nw v n -5 - +5 v between gnd-nu, nv, nw (including surge voltage) junction temperature t j - 25 - + 125 c (note 1) ipm might not respond if the input signal pulse width is less than pw on , pw off . electrical characteristics (unless otherwise specified, tj=25c , v cc =v bs =15v, v p =300v) inverter part item symbol limit unit conditions min typ max collector-emitter saturation voltage v cesat - 1.50 1. 90 v i c =1 0a - 0.85 1. 15 v i c =1a collector-emitter cut-off current i ces - - 100 a v ce =v ces fwd forward voltage v f - 1.50 2.00 v i f =1 0a fwd reverse recovery time t rr - 100 - ns inductive load, i c =1 0a high side igbt turn on delay time t on h 0.50 0.85 1.40 s inductive load, i c =1 0a high side igbt turn on switching time t c(on)h - 0.15 - s inductive load, i c =1 0a high side igbt turn off delay time t offh - 1. 60 2. 30 s inductive load, i c =1 0a hig h side igbt turn off switching time t c(off)h - 0.45 - s inductive load, i c =1 0a low side igbt turn on delay time t on l 0.80 1.60 2.50 s inductive load, i c =1 0a low side igbt turn on switching time t c(on)l - 0.20 - s inductive load, i c =1 0a low side igbt turn off delay time t offl - 1.00 1. 50 s inductive load, i c =1 0a low side igbt turn off switching time t c(off)l - 0.45 - s inductive load, i c =1 0a 50% 50% hinx linx v ce 10% 90% 10% i c t off t doff t c(off) t f 10% 10% 90% t on t don t rr t c(on) figure 4. switching time definition downloaded from: http:///
6/ 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 control part item symbol limit unit conditions min typ max whole vcc circuit current 1 i cc1 - 0.70 1.60 ma vin=0v vcc circuit c ur rent 2 i cc2 - 0.90 2.00 ma vin=5v vbs circuit current 1 i bs1 - 0.15 0.35 ma vin=0v vbs circuit current 2 i bs2 - 0.15 0.35 ma vin=5v control input(hinu,hinv,hinw,linu,linv,linw) h level input current i inh 0.7 1.0 1.5 ma v in =5v l level input current i in l - 10 - - a v in =0v h level input threshold voltage v inh - - 2.6 v l level input threshold voltage v inl 0.8 - - v input hysteresis voltage v hys - 0.25 - v short circuit current protection ci n input bias current i cin -2 - - a cin=0v trip voltage v sc 0.43 0.48 0.53 v under voltage locked o ut vc c trip voltage v ccuvt 10.5 11.5 12.5 v vcc release voltage v ccuvr 11 12 13 v vb s trip voltage v bsuvt 10 11 12 v vb s release voltage v bsuvr 10.5 11.5 12.5 v thermal shutdown trip temperature t sdt 10 0 130 - c monitor lvic temperature hysteresis temperature t sd hys - 20 - c monitor lvic temperature fault output(fo) output low voltage v fo - - 0.95 v i fo =1ma leak current i foleak - - 10 a v fo =5v output pulse width t fo 20 - - s bootstrap diode p art item symbol limit unit conditions min typ max forward voltage v fb 1 0.3 0.6 0.9 v i fb =1ma voltage drop between hvcc-vbx (x=u,v,w) v fb 2 1.1 2.0 2.9 v i fb =100ma voltage drop between hvcc-vbx (x=u,v,w) reverse current i rb - - 10 a v rb =600v reverse recovery time t rrb - 80 - ns i fb =0.1a downloaded from: http:///
7/ 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 mechanical characteristics and ratings item limit unit following standard conditions min typ max mounting torque 0.59 0.69 0.78 n ? m - mounting screw m3 (note 1) recommended 0.69n ? m (note 2) pin pulling strength 10 - - s eiaj- ed -4701/400 load control pin:4.9n power pin:9.8n pin bending strength 2 - - times eiaj- ed -4701/400 load control pin : 2.45n power pin:4.9n 90deg. bend weight - 10 - g - heat sink flatness 0 - +200 m - measurement p oint is provided in figure 6. (note 1) plain washers (iso 7089 to 7094) are recommended. (note 2) when installing a module to a heat sink, excessive uneven fastening force might apply st ress to inside chips or ceramic of heat sink plate, which will break or crack or degrade a module. an example of recommended fastening sequence is shown in figure 5. t he temporary fastening torque is set to 20 to 30% of the maximum torque rating. evenly apply therma lly -conductive grease with 100m to 200m thickness over the contact surfac e between the module and the heat sink. also, pay attention not to have any dirt left on t he contact surface between the module and the heat sink. it is recommended to install a module directly to a heat sink after applying grease. when inst alling a module to a heat sink, inserting a rubber sheet between a module and a heat sink might apply stress depending on thickness and elastic modulus of the rubber sheet to inside chips or ceramic of heat sink plate, which will break or crack or degrade a module. figure 6. measurement point of heat sink flatness figure 5. example of recommended fastening sequence (+) (+) top view 2 1 temporary fastening 1 2 permanent fastening 1 2 downloaded from: http:///
8/ 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 typical performance curve 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.2 0.4 0.6 0.8 1.0 i fo [ma] v fo [v] t j=25 v cc =15v 0 100 200 300 400 500 0 3 6 9 12 15 v f [v] i f [ma] tj=25 v cc =15v 0 25 50 75 100 125 150 175 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 v f [v] i f [ma] t j=25 v cc =15v figure 7. i f vs v f characteristic of bootstrap diode i f -v f curve between hvcc-vbx pin (x=u,v,w) figure 8. magnification of figure 7 figure 9. v fo vs i fo (characteristic of fo pin v fo -i fo curve) downloaded from: http:///
9/ 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 timing chart 1) short circuit current protection (protection with the external shunt resistor and rc filter) a1. normal operation: igbt on and outputs current i c. a2. short circuit current detection (scp trigger) it is recommended to set rc time constant of 1.0 to 2.0s so that igbt shuts down within 2.0s when scp is triggered. a3. all low side igbt s gates are shut down (soft turn off). a4. all low side igbts turn off. a5. fo outputs for t fo = 20 s (min). a6. lin=l a7. lin=h, but all igbts keep off during scp=h. a8. fo finishes output , but igbt s don t turn on until inputting the next on signal(lin=l h) igbt of each phase can return to normal state by inputting on signal to each phase. a9. normal operation: igbt on and outputs current i c . notice scp works only for low side igbt only. in case of scp trip and fo output, please stop controlling ipm quickly to avoid the abnormal state. a8 lin a7 set reset a3 a9 a1 a4 a2 delay by rc filter a5 scp igbt gate ic fo scp trip current scp trip voltage a6 shunt resistor voltage figure 10 . scp timing chart downloaded from: http:///
10 / 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 2) control supply (lvcc) under voltage locked out (uvlo) b1. control supply(lvcc) voltage exceeds uvlo release level (v ccuvr ), but igbt turns on by the next on signal (lin =l h).igbt of each phase can return to normal state by inputting on signal to each phase. b2 . normal operation: igbt on and outputs current i c. b3 . lvcc drops to uvlo trip level (v ccuv t ). b4 . all low side igbts turn off in spite of control input condition. b5 . fo outputs for t fo =minimum 20s, but output is extended while lvcc is below v ccuv r. b6 . lvcc reaches v ccuv r . b7 . even if lvcc reaches v ccuvr during lin=h, igbt s don t turn on until inputting the next on signal (lin=l h). b8 . normal operation: igbt on and outputs current i c. 3) control supply (vbs) under voltage locked out (uvlo) c1. control supply (vbs ) voltage exceeds uvlo release level (v bs uvr ), but igbt turns on by the next on signal (h in=l h). c2. normal operation: igbt on and outputs current i c. c3. vbs drops to uvlo trip level (v bs uv t ). c4. only igbt of the corresponding phase turns off in spite of control input signal, there is no fo signal output. c5. vbs reaches v bs uv r . c6. even if vbs reaches v bs uv r during hin=h, igb t s don t turn on until inputting the next on signal (hin=l h). c7. normal operation: igbt on and outputs current i c. lin reset reset b1 uvlo v ccuvt ic fo set v ccuvr b3 b2 b4 b5 b6 b7 b8 lvcc hin reset reset c1 uvlo v bsuvt ic fo set v bsuvr c3 c2 c4 c5 c6 c7 vbs fo=h figure 1 2. vbs uvlo timing chart figure 1 1. lvcc uvlo timing chart downloaded from: http:///
11 / 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 4) thermal shutdown (tsd), monitoring lvic temperature d1. normal operation: igbt on and outputs current i c. d2. lvic temperature (t j ) ex ceeds thermal shutdown trip level (t sdt ). d3 . all low side igbts turn off in spite of control input condition. d4. fo outputs for t fo = 20 s (min) , but output is extended while t j is above thermal shutdown release level (t sdt -t sdhys ). d5 . t j drops to t sdt -t sdhys d6 . even if t j reaches t sdt -t sdhys during lin=h, igbt s don t turn on until inputting the next on signal (lin=l h). igbt of each phase can return to normal state by inputting on signal to each phase. d7 . normal operation: igbt on and outputs current i c. notice 1) in case of tsd trip and fo output, please stop controlling ipm quickly t o avoid the abnormal state. 2) if the cooling system is in abnormal state (e.g. heat sink comes off, fixed loosely, or cooling fan stops) when tsd trips, don t reuse ipm. this may cause the junction temperature of power chips to exceed its maximum rating of t jmax ( 150 c ). 3) tsd function detects lvic temperature, so it cannot respond to rapid temperature rise of power chip. therefore, tsd will not work properly in the case of rapid temperature rise like motor lock or over current. lin reset d1 tsd ic fo set t sdt t sdt -t sdhys t j (lvic) d2 d5 d3 d4 d6 d7 figure 1 3. tsd timing chart downloaded from: http:///
12 / 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 application example( one shunt resistor drive) figure 14. example of application circuit vbu vbv vbw hinu hinv hinw hvcc gnd linu linv linw lvcc fo cin gnd p u v w nu nv nw m low side gate driver (lvic) high side gate driver (hvic) 24 23 22 21 20 19 18 mcu + 2 3 4 8 9 15 16 15v 14 10 11 12 13 5 6 7 5v + c1 d1 c2 c2 c2 d1 c3 + + r2 c5 r1 c4 shunt resistor bootstrap negative electrodes should be connected to u, v, w pin s directly and separated from the main output wires. long wiring here might cause short circuit failure. n d c long wiring here might cause scp level fluctuation and malfunction. a b + downloaded from: http:///
13 / 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 selection of components externally connected (refer to figure 14) 1) vbu , vbv , vbw p in ? the bypass capacitor(good temperature, frequency characteristic electrolytic type c1: 22f to 100f) should be mounted as close as possible to the pin in order to prevent malfunction or destruction due to switching noise and power supply ripple. in addition, for the purpose of reducing of the power supplys impedance in wide frequency bandwidth, ceramic capacitor (good temperature, frequency and dc bias characteristic ceramic type c2: 0.1f to 0.22f) should also be mounted. ? zenner diode d1(1w) should be mounted between each pair of control supply pin s to prevent surge destruction. ? line ripple voltage should meet dv/dt 1v/s , v ripple 2v p-p. ? the wiring from u, v, w pin should be as thick and as short as possible. they should be connected directly and separated from the main output wires. 2) hvcc , lvcc pin ? the bypass capacitor(good temperature, frequency characteristic electrolytic type c3) should be mounted as close as possible to the pin in order to prevent malfunction or destruction due to switching noise and power supply ripple. in addition, for the purpose of reducing of the power supplys impedance in wide frequency bandwidth, ceramic capacitor (good temperature, frequency and dc bias characteristic ceramic type c2: 0.1f to 0.22f) should also be mounted. ? zenner diode d1(1w) should be mounted between each pair of control supply pin s to prevent surge destruction. ? line ripple voltage should meet dv/dt 1v/s , v ripple 2v p-p. 3) p pin ? to prevent surge destruction, the wiring between the smoothing capacitor and p, n pin s should be as short as possible. ? snubber capacitor(c4: 0.1f to 0.22f) should be mounted between the p- n pin . 4) control input pin (hinu , hinv , hinw , linu , linv , linw) ? the wiring should be as short as possible to prevent malfunction. ? input drive is active-high type. there is a 3.3k ? (min) pull-down resistor in the input circuit of i pm . when using rc coupling circuit, make sure the input signal level meet the input threshold voltage. ? dead time of input signal should be more than specified value. 5) fo pin ? fo output is open drain type. it should be pulled up to control power supply(e.g. 5v, 15v) by a resistor that makes i fo up to 1ma.i fo is estimated roughly by the formula of control power supply voltage divided by pull-up resistance(r1). in the case of pulled up to 5v, r1=10k ? is recommended. 6) cin pin ? rc filter(r2, c5) should be mounted as close as possible to the pin in order to prevent malfunction by recovery current or switching noise. it is recommended to select tight tolerance, temp-compensated type for rc filter (r2, c5). the time constant r2c5 (1.0s to 2.0s is recommended) should be set so that scp current is shut down within 2s. please confirm operation on the actual application since scp shutdown time changes depending on the pcb wiring pattern. ? the point d at which the wiring to cin filter is divided should be near the pin of shunt resistor. nu, nv, nw pin should be connected at near nu, nv, nw pin . ? to prevent malfunction, the wiring of b should be as short as possible. 7) gnd pin ? two gnd pins (9 & 16 pin) are connected inside ipm. please connect one pin (16 pin is recommended.) to the 15v power supply gnd outside and leave the other open. ? if control gnd is connected with power gnd by common broad pattern, it may cause malfunction by power g nd fluctuation. it is recommended to connect control gnd and power gnd at only a point n (near the pin of shunt resistor). ? to prevent malfunction, the wiring of a should be as short as possible. 8) nu , nv , nw pin ? when operating with one-shunt resistor, please short the three pins(nu, nv, nw). in addition, to prevent malfunction, the wiring of c should be as short as possible. downloaded from: http:///
14 / 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 9) one-shunt resistor drive 10) three-shunt resistors drive ? it is not recommended to input the voltage of each shunt resistor directly to the cin pin when ipm is operated with three shunt resistor. in that case, it is necessary to use the external protection circuit as below. ? it is necessary to set the time constant r u f f (1.0s to 2.0s is recommend ed) of external comparator input so that igbt stops within 2s when short circuit occurs. please confirm operation on the actual application since scp shutdown time changes depending on the pcb wiring pattern. ? it is recommended for the threshold voltage vref to be set to the same rating of short circuit trip level(v sc =0.48v(typ)) ? to prevent malfunction, the wiring of a, b, c should be as short as possible. ? or output high level when protection works should be 0.53v(maximum v sc rating) to 7v(cin absolute maximum rating). ipm gnd nu nv nw nu, nv, nw should be all connected each other at nearest pins. n wiring inductance should be less than 10nh. (inductance of a copper pattern with length=17mm, width=3mm is about 10nh.) low inductance shunt resistor like surface mounted (smd) type is recommended. rc filter wiring from gnd pin should be connected close to the pin of shunt resistor. wiring from shunt resistor to rc filter should be connected near the pin of shunt resistor. figure 15 . wiring pattern around the shunt resistor when operating with one-shunt resistor figure 16 . wiring pattern around the shunt resistor when operating with three-shunt resistors ipm gnd nu nv nw n wiring inductance should be less than 10nh. (inductance of a copper pattern with length=17mm, width=3mm is about 10nh.) wiring from gnd pin should be connected close to the pin of shunt resistor. cin vref 5v wiring from shunt resistor to rc filter should be connected closet to the pin of shunt resistor. external protection circuit + - + - + - comparator (open collector type) b a c or output r f c f downloaded from: http:///
15 / 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalence circuit hinx linx 5k 5k lvcc fo vbx x p nx gnd lvcc hvcc lvcc cin figure 1 7. input / output equivalent circuit (x=u, v, w) downloaded from: http:///
16 / 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power s upply connecting the power supply in reverse polarity can damage the ipm. take pr ecautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ipm s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. however, pins that drive inductive loads (e.g. motor driver outputs, dc-dc converter outputs) may inevitably go below ground due to back emf or electromotive force. in such cases, the user should make sure that such voltages going below ground will not cause the i pm and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and pcb wiring to name a few. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signa l ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip ma y result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ipm can be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ipm, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ipm has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of groun d wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ipm in the presence of a strong electromagnetic field may cause the ipm to malfunction. 9. testing on application boards when testing the i pm on an application board, connecting a capacitor directly to a low-impedance output pin may subject the i pm to stress. always discharge capacitors completely after each process or step. the i pm s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the i pm during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the i pm on the pcb. incorrect mounting may result in damaging the i pm . avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an i pm are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the i pm . so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. area of safe operation (aso) operate the i pm such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). downloaded from: http:///
17 / 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 ordering information b m 6 3 3 6 3 s - xx part number package s: hsdip25 :hsdip25vc packaging and forming specification - va : tube, long pin type -vc: tube, staggered type(control side) marking diagram part number marking lot number bottom view downloaded from: http:///
18 / 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name hsdip25 downloaded from: http:///
19 / 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information C continued package name hsdip25 vc downloaded from: http:///
20 / 20 bm63 363 s- va bm63363s- vc tsz02201-0747ab500070-1-2 ? 20 14 rohm co., ltd. all rights reserved. 07.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 05.aug.2014 001 new release 11.nov.2014 002 bm63363s-vc added 07 .apr.2016 00 3 page 7: (note 2) expression changed page 7: (note 2) notice for using a rubber sheet added page 16:operational notes changed downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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